EUV Pellicle Market Size worth $1,793.61 Million by 2032 | CAGR: 14.90%

The global EUV Pellicle Market is expected to grow at growth rate of 14.90% to reach USD 1,793.61 Million by 2032.

An EUV pellicle is a highly specialized, ultra-thin membrane used in Extreme Ultraviolet (EUV) lithography—a next-generation technology critical for manufacturing cutting-edge semiconductor devices with extremely small features. Operating at a 13.5 nm wavelength, EUV lithography enables the precise etching of intricate patterns on semiconductor wafers, essential for advanced chips used in applications such as AI, 5G, and high-performance computing. The EUV pellicle plays a vital role in this process by protecting the photomask (also called a reticle) from particle contamination. Any particles on the photomask can distort the EUV light path and result in defects during the patterning process. Positioned above the mask, the pellicle allows EUV light to pass through while acting as a barrier against contaminants, ensuring higher yields and cleaner production runs.

Because EUV light is highly energetic, pellicle materials must be exceptionally durable, transparent to EUV wavelengths, and resistant to thermal and radiation-induced degradation. Materials such as ultra-thin carbon-based films or silicon compounds are typically used, and ongoing research continues to improve their transmissivity, reflectivity, and heat resistance. As EUV technology becomes a cornerstone for producing sub-5nm and future node devices, EUV pellicles are becoming indispensable. According to the U.S. Department of Energy, the global semiconductor market is projected to exceed $1 trillion by 2030, and EUV lithography will be essential to achieving this growth. The development and commercialization of robust EUV pellicles will directly influence the scalability, cost-effectiveness, and success of next-generation semiconductor manufacturing.

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The increasing integration of extreme ultraviolet (EUV) lithography into advanced semiconductor manufacturing is a primary catalyst for the EUV pellicle market’s growth. As chipmakers move toward smaller process nodes (5nm, 3nm, and below), EUV lithography has become indispensable for achieving the high-resolution patterning required for next-generation semiconductors. However, the extreme sensitivity of EUV systems to even microscopic particles necessitates strict contamination control—a challenge effectively addressed by EUV pellicles. EUV pellicles act as protective membranes that shield photomasks from particles without obstructing the EUV light used in lithography. Their use improves production yields, reduces costly rework, and enhances process reliability, making them a critical component of the EUV ecosystem. As EUV lithography adoption grows, especially among industry leaders like TSMC, Samsung, and Intel, the demand for high-performance pellicles is rising in parallel.

Material and engineering innovations are further accelerating market expansion. Early pellicles faced limitations in EUV transmittance and thermal durability, which affected lithography throughput and consistency. However, advancements in carbon-based nanomaterials, silicon nitride membranes, and ultra-thin multilayer structures are overcoming these barriers, enabling pellicles to withstand intense radiation and thermal loads while maintaining over 90% EUV light transmission. According to the U.S. Semiconductor Industry Association (SIA), the global semiconductor market is projected to surpass $1 trillion by 2030, with EUV lithography playing a foundational role in this growth. As EUV becomes more entrenched in mainstream chip fabrication, the need for robust, reliable pellicles will continue to climb, making this segment a critical enabler of next-generation semiconductor innovation.

KEY BENEFITS OF THE REPORT:

• Insights into strategies adopted by key players to maintain competitiveness.
• Comprehensive analysis of the leading companies shaping the competitive landscape.
• Examination of the key drivers fuelling global market growth.
• Identification of the geographic regions expected to experience the highest growth.
• Detailed evaluation of the current market conditions and future growth projections.

In the EUV pellicle market, companies are strategically aligning their efforts around technological innovation, collaborative development, and scaling production capacity to address the complex requirements of next-generation semiconductor manufacturing. As extreme ultraviolet lithography becomes a cornerstone for producing chips at 5nm and below, pellicles must meet increasingly stringent performance standards—including higher EUV transmittance, thermal stability, and particle resistance. Leading firms are investing heavily in R&D to develop next-generation pellicles made from advanced materials like ultra-thin carbon-based composites and silicon-based membranes. These innovations aim to improve durability and efficiency, ensuring minimal distortion under high-energy EUV exposure and enabling longer pellicle lifespans. Enhanced optical and mechanical properties also support higher throughput in chip production, which is critical for cost-effectiveness and yield optimization.

In parallel, strategic partnerships are playing a key role in market expansion. Collaborations between pellicle developers, semiconductor foundries (e.g., TSMC, Samsung), and equipment manufacturers (e.g., ASML) help ensure that pellicles are customized and optimized for specific EUV lithography platforms. These alliances foster joint development environments where performance feedback can be rapidly integrated into product design, accelerating time-to-market and enabling seamless tool integration. To meet rising demand, especially in light of the $1 trillion global semiconductor market forecast by 2030, companies are also scaling production capabilities and building regional manufacturing hubs. This not only supports higher output but also enhances supply chain resilience, a key factor given the sensitive and high-cost nature of EUV pellicles.

The scope of this report covers the market by its major segments, which include as follows:

Market Segmentation

The scope of this report covers the market by its major segments, which include as follows:

GLOBAL EUV PELLICLE MARKET KEY PLAYERS- DETAILED COMPETITIVE INSIGHTS

• ASML Holding N.V.
• Mitsui Chemicals, Inc.
• Shin-Etsu Chemical Co., Ltd.
• FUJIFILM Holdings Corporation
• Toppan Inc.
• SÜSS MicroTec SE
• Entegris, Inc.
• AGC Inc.
• Sumitomo Chemical Co., Ltd.
• SKC Co., Ltd.
• Others

GLOBAL EUV PELLICLE MARKET, BY MATERIAL TYPE- MARKET ANALYSIS, 2019 - 2032

• Carbon-based
• Silicon-based

GLOBAL EUV PELLICLE MARKET, BY APPLICATION- MARKET ANALYSIS, 2019 - 2032

• Consumer Electronics
• Semiconductor Foundries
• Memory Devices
• Other Applications

GLOBAL EUV PELLICLE MARKET, BY END USER- MARKET ANALYSIS, 2019 - 2032

• Electronics
• Automotive
• Aerospace
• Medical Devices
• Telecommunications
• Others

GLOBAL EUV PELLICLE MARKET, BY REGION- MARKET ANALYSIS, 2019 - 2032

North America

• U.S.
• Canada

Europe

• Germany
• UK
• France
• Italy
• Spain
• The Netherlands
• Sweden
• Russia
• Poland
• Rest of Europe

Asia Pacific

• China
• India
• Japan
• South Korea
• Australia
• Indonesia
• Thailand
• Philippines
• Rest of APAC

Latin America

• Brazil
• Mexico
• Argentina
• Colombia
• Rest of LATAM

The Middle East and Africa

• Saudi Arabia
• UAE
• Israel
• Turkey
• Algeria
• Egypt
• Rest of MEA